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Ceramic Substrate With Recessed Pins Disclosure Number: IPCOM000066013D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue


Related People

Anderson, GE [+details]


The number of process steps can be reduced and a larger circuitizing area made available by recessing I/0 pins within a ceramic substrate prior to metallization of the substrate.