Technique For Brazing A Frame On A Substrate
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19
In hermetically sealed semiconductor device packages it is a common practice to braze an attachment frame to the ceramic substrate. In forming the brazed joint between the flange and the substrate, it is important that the thickness of the braze material be uniform in order to form an effective, strong joint. Collapse of the frame onto the substrate causes weak, thin joints which are undesirable. Further, any reworking of the substrate which involves heating could remelt the brazed material, allowing the reforming of a thin, weak joint.