Browse Prior Art Database

Technique For Brazing A Frame On A Substrate

IP.com Disclosure Number: IPCOM000066031D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Palmateer, PH Poweleit, HR [+details]

Abstract

In hermetically sealed semiconductor device packages it is a common practice to braze an attachment frame to the ceramic substrate. In forming the brazed joint between the flange and the substrate, it is important that the thickness of the braze material be uniform in order to form an effective, strong joint. Collapse of the frame onto the substrate causes weak, thin joints which are undesirable. Further, any reworking of the substrate which involves heating could remelt the brazed material, allowing the reforming of a thin, weak joint.