Browse Prior Art Database

Self-Contained Data Processing Package With I/O And Supply Through A Capturing Interposer

IP.com Disclosure Number: IPCOM000066032D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Arnold, AJ Hardin, PW Ricci, R [+details]

Abstract

The drawing illustrates a data processing package composed of an integrated circuit module 1 connected to a power distribution card 2 and signal connectors 3 through a capturing interposer 4. Capture of the various components is by means of reflow and solidification of high temperature melting solder 5 and low temperature melting solder 6 contained in the opposite sides of "H" buckets 7 imbedded along with heaters 8 in the interposer 4.