Self-Contained Data Processing Package With I/O And Supply Through A Capturing Interposer
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19
The drawing illustrates a data processing package composed of an integrated circuit module 1 connected to a power distribution card 2 and signal connectors 3 through a capturing interposer 4. Capture of the various components is by means of reflow and solidification of high temperature melting solder 5 and low temperature melting solder 6 contained in the opposite sides of "H" buckets 7 imbedded along with heaters 8 in the interposer 4.