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Thermal Conduction Piston For SemiConductor Packages Disclosure Number: IPCOM000066057D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

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Landstein, L [+details]


The use of a slidable piston in a device cooling structure to remove heat from a semiconductor device and transfer it to a cold plate is shown in U.S. Patent 3,993,123. This structure constitutes an improvement in the aforementioned cooling concept.