Browse Prior Art Database

Thermal Conduction Piston For SemiConductor Packages

IP.com Disclosure Number: IPCOM000066057D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Landstein, L [+details]

Abstract

The use of a slidable piston in a device cooling structure to remove heat from a semiconductor device and transfer it to a cold plate is shown in U.S. Patent 3,993,123. This structure constitutes an improvement in the aforementioned cooling concept.