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Aluminum Spacer Bond Medium

IP.com Disclosure Number: IPCOM000066084D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Perry, CH [+details]

Abstract

Current spacer technology in large-size plasma discharge devices requires that a plurality of metallic spacer elements be surface bonded to one of the dielectric surfaces such that the relative placement and tolerances of the spacer elements with respect to the conductor lines are very critical. It is also essential to minimize any degradation of the adjacent plasma cells to the spacer element due to variations in dielectric thickness or chamber gap. Nickel-iron alloy spacers have been proposed as the spacing medium in which a spot of solder glass was employed to bond each spacer element to the dielectric surface. During this bonding operation, the solder glass on the spacer element melts and wets the dielectric surface. However, this process has several requirements which create difficulties in implementation.