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Removal Of Oxidized Flux Disclosure Number: IPCOM000066099D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

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Antonucci, RF Carr, BT Lennon, W Schlesier, RM [+details]


Semiconductor chips may be connected to ceramic substrates by solder reflow techniques, using a flux. After heating, the flux becomes oxidized, and it is necessary to remove it. Described herein is a process for removing a flux, which is a rosin-type flux, with benzyl alcohol solvent. When such a flux is oxidized, it can readily be removed as follows: 1. Immerse substrate in benzyl alcohol for a period of time, and agitate the substrate. 2. Spray the substrate surface with benzyl alcohol for a shorter period of time. 3. Spray the substrate with isopropyl alcohol for another short period of time. 4. Vacuum bake the substrate to drive off any residual alcohol.