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Self Regulating Evaporative/Conductive Thermal Link

IP.com Disclosure Number: IPCOM000066101D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Moran, KP Simons, RE [+details]

Abstract

An improved thermal path from the chip 10 to the primary coolant 12 is provided as shown in Fig. 1. The link consists of a sealed flexible spring-like metallic bellows 14 which contains an internal wick 16. The wick is initially wetted with a secondary coolant 18 which evaporates at the hot end and condenses at the cool end during the heat transfer process.