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Low Induced Noise Magnetic Bubble Memory Test Assembly

IP.com Disclosure Number: IPCOM000066131D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chrysler, JA Mathers, MR Mortelmans, J [+details]

Abstract

The chip input output assembly of a magnetic bubble module having a low noise level is shown in the drawing. The assembly contains a rigid substrate 12 that has four areas 14 for external connections. A preferred material for the substrate 12 is a ceramic. An alternative material is a rigid plastic, such as a polyimide, which may or may not be reinforced with strands of a stronger material.