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Magnetic Bubble Memory Module With A Thin Media I/O Structure

IP.com Disclosure Number: IPCOM000066132D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Mathers, MR Sykes, R [+details]

Abstract

The chip input output (I/O) assembly components of a magnetic bubble module having a low noise level is shown in Figs. 1 and 2. The assembly contains a flexible plastic substrate 12 that has four equal areas 14 for external connections. A preferred material for the substrate 12 is a polyimide. The areas 14 have copper signal lines 16 which are in electrical connection to pins 18.