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Vapor Deposition Of Thick Niobium Layers By Photoresistant Stripping

IP.com Disclosure Number: IPCOM000066141D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Sasso, GG Daetwyler, K [+details]

Abstract

During vacuum deposition of niobium, the underlying layer of photoresist often develops cracks and peels-off under the intense heat radiation of the vapor source as well as the thermic stress in the niobium layer. This is particularly bothersome when the photoresist covers small lines and bridges only. It was found that a thin layer of niobium blanket deposited on the blanket photoresist before development renders the resist sufficiently stable against heat-up during subsequent deposition.