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Void Free Pb-Sn Solder

IP.com Disclosure Number: IPCOM000066154D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Chance, DA Ozols, G Dalal, H [+details]

Abstract

Voids or bubbles may be found in C4 solder balls under certain processing conditions. This process application includes: