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Silicon Heat Sink Method To Control Integrated Circuit Chip Operating Temperatures

IP.com Disclosure Number: IPCOM000066155D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Ahearn, WE Beck, VD [+details]

Abstract

A technology is described for cooling integrated circuit chips with silicon heat sinks which can be tailored to the dissipation level of individual chips. Such a method is applicable to chips bonded to multilayer ceramic substrates using solder technology.