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Photoresist Stencil Using Multiple Layers Of Positive Photoresist

IP.com Disclosure Number: IPCOM000066175D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Gilligan, VD Johnson, C Palmer, MJ Pan, ES Patt, RM Warnecke, AJ [+details]

Abstract

When fabricating device components, it is often necessary to deposit materials, such as metals, onto a substrate using photoresist stencils. When positive photoresists of different photographic speeds are used, the profile of the developed image can be controlled to insure stencil lift-off. However, there has been considerable difficulty in coating multiple photoresist layers without removing or damaging the first photoresist coated on the substrate.