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Photoresist "Bubble" Application Apparatus

IP.com Disclosure Number: IPCOM000066176D
Original Publication Date: 1979-Jan-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Drake, RE [+details]

Abstract

The apparatus described herein allows the application of a thin, pinhole free, uniform membrane, or "bubble", of a material, such as photoresist, to a wafer or substrate. It also insures good uniformity in thickness and exposure/development properties.