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High Vacuum Glass Copper Connection Using Thermo-Compression Bonding

IP.com Disclosure Number: IPCOM000066210D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Horky, GJ [+details]

Abstract

A lead glass to copper connection for high vacuum use, such as in an electron gun assembly, can be accomplished using heat and compression during the bonding process. As shown in the figure, a lead glass envelope of the electron gun assembly is connected to a copper housekeeper type connector which in turn is fastened to a blank copper flange.