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Evaporation Mask And Apparatus Cleaning

IP.com Disclosure Number: IPCOM000066240D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Rainford, RE Ward, WC [+details]

Abstract

Bulk lead-tin deposits can be removed from the surface of refractory material by coating the solder-covered refractory material with a lower temperature eutectic alloy that reacts with the bulk lead-tin solder coating to form a still lower temperature eutectic alloy that has a melting temperature below that of boiling water, such that this second formed alloy can be washed off the refractory material in boiling water. To completely clean the surface of the refractory material of any residual film, a chemical etch is required.