Wafer Frontside/Backside Tab Exposure Tool
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19
In the semiconductor manufacturing process, photo aligners are widely used. In such aligners it has been found that a lip or buildup of resistive material on the rim of the front of the wafer or material on the backside of the wafer can cause exposure and alignment problems which, in turn, cause yield loss. The tool in the arrangement shown above provides a blanket exposure of the backside of the wafer and a selective frontside exposure of the wafer so that unwanted resistive areas on the backside of the wafer and any lip on the rim of the front of the wafer can be developed away prior to the insertion of the wafer in the photo aligners.