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Brazing Alloys For I/O Pins To Multilayer Ceramic Electronic Modules

IP.com Disclosure Number: IPCOM000066250D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Hitt, GE Wild, RN [+details]

Abstract

New braze alloys are described here that have good strength, good corrosion resistance and special melting points for the fabrication of electronic modules.