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Method Of Preparation Of Controlled Chip Joining

IP.com Disclosure Number: IPCOM000066253D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Bakos, P Gow, J Homa, TR Turner, JF [+details]

Abstract

Integrated circuit (IC) devices require multiple connections between the IC chip and module. This is accomplished by placing the chip and module in contact and carrying out a solder reflow operation wherein the molten solder aligns the chip to its required position. Generally, Pb/Sn is used to obtain adequate interconnections between the device and the substrate since Pb/Sn offers excellent protection against chemical pollutants.