Method Of Preparation Of Controlled Chip Joining
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19
Integrated circuit (IC) devices require multiple connections between the IC chip and module. This is accomplished by placing the chip and module in contact and carrying out a solder reflow operation wherein the molten solder aligns the chip to its required position. Generally, Pb/Sn is used to obtain adequate interconnections between the device and the substrate since Pb/Sn offers excellent protection against chemical pollutants.