Browse Prior Art Database

Multifunction Plug For IC Package

IP.com Disclosure Number: IPCOM000066254D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
McBride, DG [+details]

Abstract

In this pluggable module package, threaded plastic plug 1 contacts with mating threaded aperture 2 of molded pin carrier substrate 3. Integrated circuit (IC) chip 4 has underlaying input/output (I/O) terminals (not shown) which are bonded, e.g., by solder, to the printed-circuit (PC) pads 5 located on the upper surface of the thin polyimide flexible decal 6. Partially shown fan-out PC conductor pattern 7 of decal 6 interconnects pads 5 with the conductive concentric PC lands of via holes 8. The latter in turn are, e.g., solder bonded on the top surface of decal 6 to the protruding tops T of I/O pins 9 carried by substrate 3. Protective and heat sink cover 10 encloses the assembly and has a depressed center portion 11 which is backbonded to the top of chip 4 to effect a thermal conductive path between chip 4 and cover 10.