Browse Prior Art Database

Cap For Reworkable MC Modules

IP.com Disclosure Number: IPCOM000066255D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
DeMaine, FJ Petrozello, JR Tomek, RE [+details]

Abstract

A necessary step in the repair of integrated circuit modules is to provide the modules with caps which permit module rework. Such caps should meet two criteria: 1. The module cap should be readily removable and replaceable such that the thermal or moisture sealing properties of the cap are retained. 2. The repaired module should be indistinguishable from a nonrepaired module.