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Hermetically Sealed Chip Connection Disclosure Number: IPCOM000066271D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

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Langdon, JL [+details]


In this structure (Fig. 1), a semiconductor device 10 is provided with a peripheral solder band 12 which surrounds the conventional solder pad configuration 14. As illustrated in Fig. 2, the solder band 12 is joined to a similarly shaped solder wettable area on substrate 16, while the pads 14 are joined to solder wettable areas which make contact to metallurgy in or on substrate 16.