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Technique For Preventing Screening Paste Pull Out From Vias In A Screened Ceramic Green Sheet

IP.com Disclosure Number: IPCOM000066272D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Desai, KS [+details]

Abstract

In the fabrication of multilayer ceramic (MLC) substrates, ceramic green sheets are punched to form via holes which are subsequently filled with conductive paste, and a pattern is deposited on the top surface. During the screening operation, it is conventional to support the ceramic green sheet on a backing sheet of impervious material to prevent the conductive paste from being forced through the holes into contact with the apparatus. The backing sheet is subsequently removed, and the green sheets are laminated. During the removal of the backing sheet a portion of the conductive paste may be removed along with the sheet, which is objectionable.