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Cooled Rotatable And Adjustable Radio Frequency Cathode In A Thin Film Evaporator

IP.com Disclosure Number: IPCOM000066276D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Carbone, QJ Caulfield, JJ Nowakowski, L Petvai, SI Wernikowski, RC [+details]

Abstract

A cathode sputtering system is described which facilitates thin film deposition by providing a cooled and rotatable cathode in a thin film evaporator. The device includes a processing chamber 10 having a cooled, rotatable wafer-retaining structure 12 mounted therein. Structure 12 includes two adjustable arms 14, 16 each of which is adapted to receive and retain a wafer nest. 'Structure 12 is rotatably mounted within chamber 10 by means of a drive shaft 18 powered by a drive dome 20.