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Hook And Loop Thermal Conductive Mesh

IP.com Disclosure Number: IPCOM000066296D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Parsapour, H [+details]

Abstract

The figure shows how hooks 10 and loops 12 may bc mounted to a module cap 14 and a semiconductor chip 16, respectively, for engagement when cap 14 is pressed onto module 18. Significant thermal conductivity will be provided by virtue of the mechanical contact of hooks 10 and loops 12.