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Nondestructive Test Of Josephson Junction Device Resistance To Failure Under Thermal Cycling By Means Of Acoustic Emission Monitoring

IP.com Disclosure Number: IPCOM000066382D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Kircher, CJ Melcher, RL Murakami, M VanVechten, JA [+details]

Abstract

Acoustic emission (AE) monitoring of materials subject to a variety of stresses is an established art that has been applied to geology and structural materials for several years (1,2). It has recently been applied to electronic devices during their normal operation (1). Proposed here are methods to apply this art to predict the survival of Josephson devices during thermal cycling.