Monitor For Development Of Fine Patterns In Resist Layers
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19
One of the most difficult problems encountered in obtaining high resolution lithography is that of stopping the development of the pattern in a resist layer at the correct time. For the additive, electroplated metallurgy currently in use in some applications of magnetic bubble technology, for example, underdevelopment causes lines and bars which are too narrow and gaps which are too wide, while overdevelopment leads to bars which are too wide and gaps which are too narrow. Either extreme can adversely affect the margins of devices being made.