Browse Prior Art Database

Increased Density Connector For The Low End Card On Board Package

IP.com Disclosure Number: IPCOM000066396D
Original Publication Date: 1979-Feb-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Agard, RL Pavlik, J Thomas, DL [+details]

Abstract

This article describes a relatively low-cost, high density connector for connecting a printed-circuit card 10 to a printed-circuit board 11. The card 10 has circuit pads 12 on its surface. The top row of pads is soldered to a spring connector 15, and the bottom row of pads is soldered to an H-shaped connector 17. The spring connectors 15 make contact with pins 19, while the H-shaped connector 17 makes connection with pins 20. Pins 19 and 20 are soldered into board 11.