Carrier Strip Break-off Mechanism
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-19
Mechanism 1-10 is part of a partially shown rotary hot air solder machine 11-15. The machine has a soldering station (not shown) at which the contacts C formed on common carrier strip S are solder reflow bonded to aligned pads on each side of printed-circuit (PC) card or board B mounted in the slidable machine fixture 11. Mechanism 1-10 removes strip S, and is mounted at a contact carrier removal station A. Station A is located between the solder station and board/ fixture eject station (not shown). It eliminates subsequent manual handling and removal of the hot workpiece B and discarded strip S.