Browse Prior Art Database

Backseal Leak-In Prevention System

IP.com Disclosure Number: IPCOM000066448D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Harris, JB [+details]

Abstract

This system prevents leak-in of the uncured liquid backseal into electronic packages for integrated circuit modules, bubble memory modules and the like.