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This system prevents leak-in of the uncured liquid backseal into electronic packages for integrated circuit modules, bubble memory modules and the like.
English (United States)
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Backseal Leak-In Prevention System
This system prevents leak-in of the uncured liquid backseal into electronic
packages for integrated circuit modules, bubble memory modules and the like.
A typical package 1, for example, shown schematically in cross section,
includes pluggable module 2 with inner and outer box-like rectangular enclosures
3, 4. Input/output (I/O) pin leads 5 of module 2 extend through openings 6
provided in enclosure 3. In a bubble memory device, module 2 includes
elements (not shown) generally associated with such devices, to wit, the bubble
memory chip, I/O lead carrier, associated orthogonal field coils, permanent
magnet bias structure, and conductive shielding, if any, with enclosures 3, 4
acting also as magnetic shields.
In this backseal leak-in prevention system, a thin sheet 10 of dry adhesive,
slightly larger than the x-y dimensions of module package 1, is first pierced to
provide an undersize hole 11 at the location of each I/O lead 5. The pierced
holes 11 are smaller than the diameters of leads 5 to provide a seal-tight fit
around leads 5. The pierced adhesive sheet 10 is then forced down over leads 5
until it is in conformal contact with the horizontal outer surface of enclosure 3 and
so that its periphery drapes over the four vertical sides of outer enclosure 4. A
compressed rubber insert 12 is then fit over leads 5. Insert 12 thus expands in
the x-y plane and compresses along the Z axis. By expanding in the x-y plane,
insert 12 seals the adhesive sheet 10 along the ver...