Browse Prior Art Database

Metallized Multilayer Ceramic Packages With Welded I/O Pins

IP.com Disclosure Number: IPCOM000066449D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Funari, J Lafer, WF Phillips, GC [+details]

Abstract

The concept shown here may be used to achieve high density ceramic base packages for electronics at minimum manufacturing cost.