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The concept shown here may be used to achieve high density ceramic base packages for electronics at minimum manufacturing cost.
English (United States)
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Metallized Multilayer Ceramic Packages With Welded I/O Pins
The concept shown here may be used to achieve high density ceramic base
packages for electronics at minimum manufacturing cost.
One form of package, shown in Fig. 1, comprises a base structure of a
ceramic substrate having vias filled with moly or tungsten with screened pads on
the back side. Conventional MC (metallized ceramic) chrome copper chrome
evaporation processes may be applied to both the top and bottom surfaces to
achieve double sided wiring capability and metallurgically weldable sites for I/O
pin attachment processes. This package structure would achieve improved I/O
Another form of package is shown in Fig. 2, wherein again a
ceramic substrate is provided with vias filled with moly or tungsten;
however, there are no screened pads on the bottom. Conventional MC
chrome copper chrome evaporation processes would be applied to both
the top and bottom surfaces to achieve double sided wiring
capability and metallurgically weldable sites for I/O pin attachment.
This package eliminates the use of screened pads and would provide
tighter line density due to the shrinking of the personalized pads on
the bottom surface to the welded pin head dimension. If desired, an
organic back-seal may be employed to aid pin adhesion.
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