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Flexible Between-Board Air Baffle

IP.com Disclosure Number: IPCOM000066455D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-19

Publishing Venue

IBM

Related People

Authors:
Bucher, W DeSilva, DK Dunn, RM Timko, N Timko, N [+details]

Abstract

A flexible air baffle is used to minimize the loss of cooling air around boards, while maintaining the allowability of passing varying amounts of input/ouput cabling through a channel. With today's densely packed electronics requiring high velocity airflows past the components, large open areas around a board will offer an easy path for cooling air to escape, thereby diminishing the usefulness of the cooling air. Tests have shown that a great deal more airflow is passed over the card areas when baffles are in place in selective positions on the card board or card guide. spacing between module M and board 23. consists of a foam block, a portion of which is covered by a metal clip adapted to be inserted in a card guide.