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Evaporation Cooling Module Disclosure Number: IPCOM000066472D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-19

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Hwang, UP Moran, KP Oktay, S Pascuzzo, AL [+details]


A method of cooling a high heat density package of electrical chips mounted to a substrate is shown in Figs. 1 and 2. The cooling mechanism is evaporation or mist cooling. Unlike cooling by boiling or bubble entrapment methods, hot spot deposits are not developed. The method is also different from jet cooling, which is a form of force convection, in that coolant flow rate and pressure requirements are low. Heat is dissipated by fine droplets of coolant which evaporate when in contact with the hot semiconductor chip surfaces.