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Hermetic Hybrid Module Disclosure Number: IPCOM000066473D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-19

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Martin, B Metreaud, CG [+details]


As illustrated by Fig. 1, the proposed module is a stacked hybrid composed of a multilayer top substrate with chips distributed on both sides of the substrate and a monolithic bottom substrate supporting (a) the input/output pins, (b) the stacking pins and (c) the distribution network. Both upper and lower surfaces of the top substrate have a brazing band and hermetic cap.