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Ceramic Cap And I/O Pin Retainer For Multichip Module Packages Disclosure Number: IPCOM000066475D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-20

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Metreaud, CG Mooney [+details]


A cost effective alternative to stacked substrate assemblies (two populated substrates mounted in piggyback fashion) is a design using a double-sided semiconductor chip joining process which is represented in Fig. 1.