Browse Prior Art Database

Ceramic Cap And I/O Pin Retainer For Multichip Module Packages

IP.com Disclosure Number: IPCOM000066475D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Metreaud, CG Mooney [+details]

Abstract

A cost effective alternative to stacked substrate assemblies (two populated substrates mounted in piggyback fashion) is a design using a double-sided semiconductor chip joining process which is represented in Fig. 1.