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Semiconductor Chip Leveling Apparatus Disclosure Number: IPCOM000066527D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-20

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Rhodes, KE [+details]


In order to accurately expose the photoresist covering a semiconductor chip to a focused laser beam so that the chip circuitry may be personalized, the chip must be exactly perpendicular to the optical axis for the laser beam. A problem arises when the semiconductor chip has previously been mounted to a module substrate since it is usually the case that the semiconductor chip is not exactly parallel with the surface of the module substrate, and thus the module substrate itself cannot be used as the datum plane for orienting the semiconductor chips so as to be exactly perpendicular with the laser beam. The technique disclosed herein provides for accurate orientation of the semiconductor chip surface with respect to an optical axis so that accurate laser exposure of a photoresist layer thereon can be achieved.