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Liquid-Filled Bellows Heat Sink Disclosure Number: IPCOM000066529D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Kleinfelder, WJ Ronkese, BJ [+details]


This arrangement provides a flexible heat path between an electronic device, such as a silicon chip, and a heat sink. This lowers the operating temperature of the silicon device so that the circuit density can be increased.