Browse Prior Art Database

Liquid-Filled Bellows Heat Sink

IP.com Disclosure Number: IPCOM000066529D
Original Publication Date: 1979-Mar-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kleinfelder, WJ Ronkese, BJ [+details]

Abstract

This arrangement provides a flexible heat path between an electronic device, such as a silicon chip, and a heat sink. This lowers the operating temperature of the silicon device so that the circuit density can be increased.