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Polymer Encapsulation System For Electronic Modules Disclosure Number: IPCOM000066671D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Clark, RJ Escott, BM Howard, RT [+details]


This article describes an improved design solution to several major engineering problems including excessive permeation of moisture, metal dendrite growth, thermal fatigue failures of solder joints and low thermal conductivity encountered in encapsulating electronic modules and assemblies with filled resins.