Browse Prior Art Database

Polymer Encapsulation System For Electronic Modules

IP.com Disclosure Number: IPCOM000066671D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Clark, RJ Escott, BM Howard, RT [+details]

Abstract

This article describes an improved design solution to several major engineering problems including excessive permeation of moisture, metal dendrite growth, thermal fatigue failures of solder joints and low thermal conductivity encountered in encapsulating electronic modules and assemblies with filled resins.