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Processing PC Conductor Decals Disclosure Number: IPCOM000066676D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Gazdik, CE McBride, DG Wadhwa, SK Zucconi, TD [+details]


Certain pluggable electronic package assemblies have the input/output (I/0) terminals of one or more integrated circuit (IC) chips bonded to pads, which are part of a printed-circuit (PC) conductor pattern. The PC pattern is located on a thin flexible polyimide substrate and also includes lands. The polyimide substrate and lands have aligned openings. The extended heads of the pluggable conductor pins, which are carried in a ceramic substrate, are mounted through corresponding openings of the substrate such that each head extends into and/or protrudes slightly above a corresponding one of the PC lands to which it is bonded. As such, the PC decal is sandwiched between the pin carrier and chip, and provides strain relief due to stresses caused by thermal cycling or the like.