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Solder Height Measurement Technique

IP.com Disclosure Number: IPCOM000066679D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kapur, KN [+details]

Abstract

One of the present methods for inspecting the solder joints on microcircuit substrates to determine their height requires the manual inspection of these joints. This is accomplished by manually focusing a high magnification microscope on the solder pad and then the substrate plane which serves as a reference. The difference in focus for each pad and the substrate plane is then compared to a correlated height scale to determine the solder pad's height.