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Solder Height Measurement Technique Disclosure Number: IPCOM000066679D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Kapur, KN [+details]


One of the present methods for inspecting the solder joints on microcircuit substrates to determine their height requires the manual inspection of these joints. This is accomplished by manually focusing a high magnification microscope on the solder pad and then the substrate plane which serves as a reference. The difference in focus for each pad and the substrate plane is then compared to a correlated height scale to determine the solder pad's height.