Universal Air-Cooled Module
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20
This article describes a package design which improves heat transfer in a multilayer package for integrated circuitry. It has an expansion matching cap, and within this cap there is a thermally superior conduction member comprising a high conductivity spreader and fins which extend through the lower expansion cap and eventually form the convection cooling fins.