Browse Prior Art Database

Universal Air-Cooled Module

IP.com Disclosure Number: IPCOM000066700D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Balderes, D Lynch, JR [+details]

Abstract

This article describes a package design which improves heat transfer in a multilayer package for integrated circuitry. It has an expansion matching cap, and within this cap there is a thermally superior conduction member comprising a high conductivity spreader and fins which extend through the lower expansion cap and eventually form the convection cooling fins.