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Universal Air-Cooled Module Disclosure Number: IPCOM000066700D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Balderes, D Lynch, JR [+details]


This article describes a package design which improves heat transfer in a multilayer package for integrated circuitry. It has an expansion matching cap, and within this cap there is a thermally superior conduction member comprising a high conductivity spreader and fins which extend through the lower expansion cap and eventually form the convection cooling fins.