Browse Prior Art Database

Air Cooling Modular Package

IP.com Disclosure Number: IPCOM000066705D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Hwang, UP Moran, KP Oktay, S Pascuzzo, AL [+details]

Abstract

The air-cooling package 5 is adaptable to attach to module 6 by the use of a long stud 7. The module consists of a housing with a substrate attached. The substrate can be of a singular or multi-chip type. Spring-loaded studs provide the heat path for chip-to-module housing and finally to the air-cooled fin arrangement fastened to the module housing. The air-cooled single module structure is useful where water cooling is not available and module power does not exceed 250 watts and integrated circuit chip power does not exceed 3 watts.