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Liquid Piston Tip Disclosure Number: IPCOM000066709D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Ginnings, PD Lynch, JR [+details]


This article describes the use of a controlled volume of fluid to make thermal contact with and between a moveable piston and a moveable (based on tolerance build-up) semiconductor chip backside. The load is minimal, and in the specific case of a piston with a cylinder wall, the fluid accounts for skew and nonparallelism which would otherwise affect the area of the contacting surfaces of the piston and the chip. Capillary action holds the liquid in place at the end of the piston rod, and suitable coatings prevent interactions. Thermal resistance is minimized.