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The article in the IBM Technical Disclosure Bulletin 20,1394 (September 1977) teaches the use of excess solder joints to reduce the creep of the joints under sustained load.
English (United States)
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Dummy Pads For Reduced Thermal Resistance
The article in the IBM Technical Disclosure Bulletin 20,1394 (September
1977) teaches the use of excess solder joints to reduce the creep of the joints
under sustained load.
I have found that placing the maximum number of pads on a chip also
improves the heat transfer from a chip to its module.
Described are two methods for providing a maximum number of chip pads.
The first, shown in the figure, is to place nonfunctional joints 6' on the surface 2
of the chip (not shown). The terminal via connection 5, which connects a
functional joint 6 to a layer of metal 4 within the insulator 2 atop the chip, is
eliminated. In this way, nonfunctional joint 6' is not electrically connected to the
chip. Terminal metallurgy 5' remains to assure adhesion of joint 6' to surface 2.
The alternate method comprises forming all of the joints as functional signal
or power connections, wherein the number of pads exceeds that which is needed
to reliably handle the current density.
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