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Dummy Pads For Reduced Thermal Resistance Disclosure Number: IPCOM000066710D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Berndlmaier, E [+details]


The article in the IBM Technical Disclosure Bulletin 20,1394 (September 1977) teaches the use of excess solder joints to reduce the creep of the joints under sustained load.