Browse Prior Art Database

Pad Deformation Contactor

IP.com Disclosure Number: IPCOM000066719D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Byrnes, HP Perlman, AL Wurster, M [+details]

Abstract

Disclosed is a technique of test-contacting integrated circuit chips or wafers which incorporate minute solder pads. As shown in Fig. 1, conductive balled or planar probes are incorporated in a contactor board containing appropriate fan-out wiring. In operation, the contactor board is aligned to the product "footprint". The board is then moved toward the product to a point where the solder pads are all deformed to an appropriate height by the probes. A specific total force is then applied and the electrical test commenced.