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Pad Deformation Contactor Disclosure Number: IPCOM000066719D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

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Related People

Byrnes, HP Perlman, AL Wurster, M [+details]


Disclosed is a technique of test-contacting integrated circuit chips or wafers which incorporate minute solder pads. As shown in Fig. 1, conductive balled or planar probes are incorporated in a contactor board containing appropriate fan-out wiring. In operation, the contactor board is aligned to the product "footprint". The board is then moved toward the product to a point where the solder pads are all deformed to an appropriate height by the probes. A specific total force is then applied and the electrical test commenced.