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MLC Hole Pattern Centrality Inspection Tool

IP.com Disclosure Number: IPCOM000066720D
Original Publication Date: 1979-Apr-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Kutch, G [+details]

Abstract

In multilayer ceramic (MLC) packaging technology, green ceramic sheets are punched, thereby forming many very small holes. Conductive paste is screened into the holes and on the surface to provide internal electrical circuitry when a plurality of the sheets are assembled and sintered. However, prior to assembling by stacking one sheet on top of another to form a laminate, the punched sheets require that the pattern be positioned within 0.4 mil of the true center of the green sheet (as established by four registration holes).