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Tapered Vias In A Photosensitive Dielectric Film

IP.com Disclosure Number: IPCOM000066846D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Abolafia, OR [+details]

Abstract

Photosensitive material, such as photosensitive polyimide, can be used as an insulating layer between layers of circuitry which are deposited on a ceramic substrate. In such multilayer circuitry, connections or vias must be provided between the various layers of circuitry. It has been found that vias having tapered walls are superior to vias having straight walls.