Browse Prior Art Database

Tapered Vias In A Photosensitive Dielectric Film Disclosure Number: IPCOM000066846D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue


Related People

Abolafia, OR [+details]


Photosensitive material, such as photosensitive polyimide, can be used as an insulating layer between layers of circuitry which are deposited on a ceramic substrate. In such multilayer circuitry, connections or vias must be provided between the various layers of circuitry. It has been found that vias having tapered walls are superior to vias having straight walls.