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In many electronic components, it is necessary to fabricate, on the same surface, resistors which have widely differing resistance values.
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Dual Resistivity Thin Film Resistors on the Same Substrate
In many electronic components, it is necessary to fabricate, on the same
surface, resistors which have widely differing resistance values.
The value of a cermet resistor can be changed by selective
deposition of additional cermet material on selective resistors.
This can be done in accordance with the following process: 1. Form all resistors with an initial thin film deposition and
photoprocessing in a conventional manner. 2. Apply photoresist and develop away selective areas, whereby
the only exposed areas are those areas over resistors
requiring lower resistivity. 3. Apply a second layer of thin film resistor material over the
substrate. 4. Lift off the photoresist material and all of the resistive
material covering the layer of photoresist. In this way, the
second deposition of resistive material will only remain on
those areas where one desired to lower the resistance value. 5. Evaporate or sputter electrode material over the resistors. 6. Etch electrodes to form completed electrodes and resistors.