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Multilayer Metalized Ceramic Substrate

IP.com Disclosure Number: IPCOM000066853D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Abolafia, OR Powell, DO [+details]

Abstract

In conventional stacked modules, the various layers are held in place by the module pins.