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EC Pad For Multi-Chip-Module Substrate Nets Disclosure Number: IPCOM000066857D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

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Drumm, AD Kobesky, LJ [+details]


The physical design of engineering change (EC) chips to be mounted on a multi-chip module (MCM) can be extremely difficult if the process is constrained by the necessity to hold the chip input/output assignments constant. This is especially true in the stage of prototype and early factory release designs for MCM devices.