Browse Prior Art Database

EC Pad For Multi-Chip-Module Substrate Nets

IP.com Disclosure Number: IPCOM000066857D
Original Publication Date: 1979-May-01
Included in the Prior Art Database: 2005-Feb-20

Publishing Venue

IBM

Related People

Authors:
Drumm, AD Kobesky, LJ [+details]

Abstract

The physical design of engineering change (EC) chips to be mounted on a multi-chip module (MCM) can be extremely difficult if the process is constrained by the necessity to hold the chip input/output assignments constant. This is especially true in the stage of prototype and early factory release designs for MCM devices.